J-STD – 001E PDF

IPC J-STDE, Requirements for Soldered Electrical and Electronic Assemblies released, updated for all three classes of construction. Requirements for. Soldered Electrical and Electronic. Assemblies. IPC J-STD- E April Supersedes Revision D February IPC J-STDE April Supersedes Revision D February JOINT INDUSTRY STANDARD Requirements for. Soldered Electrical and Electronic.

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Table 1 of this standard is to be used for printed circ uit assemblies. Insulating material needs to provide sufficient electrical j-etd. AIJ leads shall [] have stress relief when the component is clip or adhesive mounted or otherwise constrained.

Under-fill or staking material Note1: Protection may be provided through a contro lIed heating process 4.

Solder fillel may exlend through the top bend. Components mounted in unsupported holes and required to be elevated shall [] be provided with lead forms at the board surfaceor other mechanical support Axial leaded components mounted vertically in unsupported holcs shall [] be mounted with lead forms or other mechanical support Axial lead components mounted vertically in supported holes shall [D I] have component height and clearance from the board to the body or weld bead requirements in accordance with the user determined dimension and shall not [] impact formfit or function 6.

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J-STDE: Requirements for Soldered Electrical and Electronic Assemblies

The preheat temperature exposure shall not [] degrade printed boardscomponentsor soldering performance 4. The coating manufacturers supplier’s inslructions or other documented process shall [D ID2D3] be followed When curing co nditi ons temperaturetimeInfra Red I. End joint width 6.

Note 2 Marking Note1: Wetting is evidenl Note 4: If no criteria is specifiedrequiredor citedthen best manufacturing practice applies. Lead diameter is less Ihan diameler or slde length 01 the solder land Note 3: The use of “statistical process control” SPC is optional and should be based on factors 5uch as design stability, lot size.

Delamination is an internal condi tion which may propagate under thermal stress and may be a catalyst for CAF growth. Other Lead-free solder alloy contamination limits may be used upon agreement between user and vendor. The philosophy, implementation strategies. Additionally, care should be taken to avoid bending or flexing conductors during mspection 9.

J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

Blisters or delamination areas may propagate during assembly or operati on. The end of the part is defined to include any coatingsolder sealsolder or weld beador any other extension.

Fails to comply with wetting criteria of 4. Wires will be used in crimp terminations b. Fine pilch leads componenllerminalions on less Ihan 0. Requ ired underfill or staking material is present and completely cured 7. AWG and j-ste 2. Does nol violale minimum eleclrical clearance Note 2: Not negate stress relief Criteria not establ ished Figure Flattened Post Termination 7. To provide for per sonnel safety, follow the applicable local and Federal OccupationalSafety and Health Regulations?

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A fi lI et shall [N1P2D3] be formed along the surfaces of contact between the wire and terminal b. The external interconnect points e.

Dynamic Extraction Methods should be performed in compliance with Test Method 001r.

Fl attened areas of! Meet the criteria of 4. Fractured solder connecti ons b.

Control of hand soldering shall [NIN2D3] include operator trainingprocess controlsand managemen t. The solder connections should have a genera Il y smooth appearance. Js-td groundingprotection and temperature control testing should be per forrned when qua1i fying equipment for purchase andlor inspection of new or repaired equipmen t.

Welting is evident Note 4: See Note 4, Table 7.